Engineering Data Sheets & Technical Resources
Welcome to the M-Cor Inc. Engineering Data Sheets & Technical Resources Library. For more than 35 years, M-Cor has established itself as one of America’s leading U.S. manufacturers of engineered specialty sealing solutions for demanding industrial applications. Our engineering and manufacturing expertise includes custom encapsulated O-rings, FFKM O-rings, bonded O-rings, molded O-rings, CamLock® gaskets, PTFE seals, FEP encapsulated O-rings, PFA encapsulated O-rings, and a broad range of corrosion-resistant and chemical-resistant seals designed for semiconductor, pharmaceutical, chemical processing, food processing, aerospace, and other critical industries.
Unlike companies that rely on offshore manufacturing, every M-Cor sealing solution is manufactured in the United States under documented manufacturing practices emphasizing quality, traceability, precision process control, engineering support, and responsive customer service. Our commitment to continuous improvement and technical excellence has earned the confidence of OEMs, design engineers, maintenance professionals, and purchasing organizations seeking dependable engineered sealing solutions for mission-critical applications.
The technical information contained within these Engineering Data Sheets & Technical Resources has been developed through more than three decades of manufacturing experience, engineering analysis, product testing, application support, and continuous product development. These publications are provided as a professional courtesy to assist engineers, designers, and procurement professionals with product selection, material evaluation, specification development, and application design. The information presented reflects M-Cor’s accumulated engineering knowledge and is intended solely as a technical design reference. It should not be interpreted as a product specification, guarantee, or warranty for any particular application.
To ensure users have access to the most current technical revisions while protecting M-Cor’s proprietary engineering resources, selected engineering documents require registration or prior authorization before viewing or downloading. This controlled access helps maintain document integrity and ensures that engineers receive the latest available technical information.
Whether you are specifying semiconductor seals, evaluating custom sealing solutions, or designing equipment requiring high-performance semiconductor sealing products, M-Cor Engineering is available to assist with material selection, application review, and design recommendations. We encourage engineers to consult with our engineering team early in the design process to achieve optimum sealing performance, long-term reliability, and reduced life-cycle costs.
Engineering Research Papers
Access to this technical publication is controlled by M-Cor Inc. and requires prior authorization. Submit the access-request form for M-Cor’s review.
TEOR Compression Force Engineering White Paper
Understand how jacket stiffness, core construction, seal diameter, compression percentage, and gland geometry affect the installation force of Teflon® encapsulated O-rings. This engineering white paper provides practical force-estimation methods, design guidance, worked examples, and procedures for validating solid- and hollow-core TEOR configurations. Download the paper to evaluate bolt-load requirements, improve gland design, and reduce the risk of stand-off, under-compression, or premature seal failure.
M-Cor TR-001 — Mechanics and Metrology of Teflon® Encapsulated O-Rings
Learn why a Teflon® encapsulated O-ring behaves as a composite structure and why its force-to-compress does not scale linearly with diameter like a conventional rubber O-ring. M-Cor TR-001 explains core-and-jacket mechanics, small-diameter hoop stress, the limitations of Shore hardness, and the controlled laboratory procedure required to measure peak and relaxed compression force accurately. Download the report to improve seal specifications, test correlation, gland design, and installation reliability in demanding applications